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Comments from the Board - Summer 2008
by Jim Lepp
Jim Lepp
Jim Lepp
• Davis Haslam, SGS International, and PLGA Technical Committee Chair, has put together an excellent program for the upcoming Technical Conference. To download program and registration form pdf for details - CLICK HERE.

• At the June 16, 2008 Board meeting in Chicago it was decided to make the Technical Conference which has been anannual event, an event that will occur on alternate years. After this year’s event which will be held at the Galt House Hotel, in Louisville Kentucky, the next Technical Conference will be held in 2010 in Charlotte, North Carolina.

• PLGA Global has been invited to participate in the European Roto Gravure Associations (ERA) annual conference on October15, 2008 in Basel, Switzerland. Charles Conover, Hurletron, will present a paper addressing the state of the Package Printing Gravure Industry in North America.

• Bray Brunkhurst, Bemis Flexible Packaging, Milprint Division, has accepted the position as the PLGA Global 2nd Vice-President. Bray will work his way up through the Executive Committee and be the PLGA Global President in 2010. Join me in welcoming Bray to his new position.

• Jean Engelke, Alcan Packaging has recently accepted the position of Newsletter Chairperson. I think we can look forward to some new looks to the newsletter in the future. If there are things you want to see, or maybe not see let us know. Jean just accepted the position so if you have comments about this issue direct them to me.

• The educational foundation is modifying how scholarship money will be awarded in the future in an attempt to direct funds to those that are more likely to enter the gravure industry in some way. One $2,000.00 general Scholarship will be awarded each year. Students from all Universities will compete for this Scholarship. Up to ten $1,000.00 Internship Grants will be awarded for students interning in the Gravure industry. Additional continued educational scholarships are being explored for employees of PLGA Member Companies.
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